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Data Package Checklist

Data Elements

  • Inner and outer layer data (all copper layers)
  • Soldermask layers
  • Legend layers
  • Aperture list if apertures are not embedded in the Gerber data (RS-274X)
  • Drill file with tool codes and X-Y coordinates of all holes in either ASCII or EIA format
  • IPC 356 netlist or mentor graphics neutral file
  • A readme file that contains an engineering contact and any special instructions

Blue Print Elements

  • Drawing in Gerber, HPGL, PDF, DXF format, or hardcopy
  • Board outline dimensions including cutouts, chamfers, radii, bevels, scores, etc.
  • Dimension from a reference hole in the board to a corner or to two sides of the board outline
  • A hole chart with the hole symbols on the drawing and the finished hole sizes
  • Material requirements
  • Finished board thickness and tolerance
  • Layer stack-up order
  • Controlled impedance requirements (if applicable)
  • Dimensioned array drawing if the design is to be shipped as a multiple -up array
  • Notes defining any other requirements or specifications pertinent to the design

Readme File

  • Engineering contact (email and phone)
  • Purchasing contact (email and phone)
  • Quantity desired (if submitted for quotation)
  • Turn-time in days (if submitted for quotation)

 

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